前言
硬件开发板：
米尔科技 MYD-YA157C
软件链接：
源码及工具 http://down.myir-tech.com/MYD-YA157C/
参考 MYD-YA157C-V2 Linux 系统开发指南 V2.0
更新时间 2020-10-10
本文着重讲述单独编译内核及更新内核部分。
获取 kernel 源代码
下载 http://down.myir-tech.com/MYD-YA157C/04_Sources.zip
拷贝解压 04-Source/MYiR-STM32-kernel.tar.bz2 到指定自定义的 work 目录（如/home/work）；
解压进入源码目录并查看对应的文件信息，如拷贝到 work 目录。
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| PC$ cd /home/work
PC$ tar -jxvf MYiR-STM32-kernel.tar.bz2
PC$ cd MYiR-STM32-kernel
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目录包含：
源代码目录：stm32mp15xc-kernel
指导说明：README. HOW_TO.txt
编译过程使用命令在README. HOW_TO.txt中都可以查看。
配置内核
进入内核目录
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| PC$ cd stm32mp15xc-kernel
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创建输出文件夹 build
内核配置
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| PC$ make ARCH=arm O="$PWD/../build" myc-ya157c_defconfig
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如需配置内核或者想打开内核某一个驱动功能也可使用如下方式。
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| PC$ cd build
PC$ make menuconfig
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编译内核
加载 SDK 环境变量
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| PC$ source /opt/st/myir/3.1-snapshot/environment-setup-cortexa7t2hf-neon-vfp
v4-ostl-linux-gnueabi
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内核配置
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| PC$ make ARCH=arm O="$PWD/../build" myc-ya157c_defconfig
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编译内核
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| PC$ make ARCH=arm uImage vmlinux dtbs LOADADDR=0xC2000040 O="$PWD/.. /build"
PC$ make ARCH=arm modules O="$PWD/../build"
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耐心等待编译完成。
生成输出文件
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| PC$ make ARCH=arm INSTALL_MOD_PATH="$PWD/../build/install_artifact" modules_install O="$PWD/../build"
PC$ mkdir -p $PWD/../build/install_artifact/boot/
PC$ cp $PWD/../build/arch/arm/boot/uImage $PWD/../build/install_artifact/boot/
PC$ cp $PWD/../build/arch/arm/boot/dts/st*.dtb $PWD/../build/install_artifact/boot/
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build/install_artifact 看到编译输出文件；
build/install_artifact/lib 目录存放的是内核模块文件；
build/install_artifact/boot 目录存放的是设备树与内核镜像文件。
修改设备树
用户可以在 BSP 源码里创建自己的设备树，一般情况下不需要修改 Bootloader 部分中的 TF-a 和 u-boot。
用户只需要根据实际的硬件资源对 Linux 内核设备树进行适当的调整即可。
| MYD-YA157C-V2 设备树列表 |
| 项目 | 设备树 | 说明 |
|---|
| Tf-a | stm32mp15xx-ya157c.dtsi | 资源设备树 |
| stm32mp157c-ya157c-512d-v2.dts | 支持 V2 核心板设备描述 |
| stm32mp15-ddr3-2x2Gb-1066-binG.dtsi | 双片 256MB DDR3 描述 |
| U-boot | stm32mp15xx-ya157c.dtsi | 资源设备树 |
stm32mp157c-ya157c-512d-v2.dts
stm32mp157c-ya157c-512d-v2-u-boot.dtsi | 支持 V2 核心板设备描述 |
| stm32mp15-ddr3-2x2Gb-1066-binG.dtsi | 双片 256MB DDR3 描述 |
| stm32mp157-pinctrl.dtsi | stm32mp157 系列处理器的 pin 脚定义 |
| Kernel | myc-ya157c_defconfig | 内核配置文件 |
| stm32mp15xx-ya157c.dtsi | 资源设备树 |
| stm32mp157c-ya157c-v2.dts | 无显示的设备树 |
| stm32mp157c-ya157c-hdmi-v2.dts | 支持 HDMI 显示的设备树 |
| stm32mp157c-ya157c-lcd-v2.dts | 支持 lcd 显示的设备树 |
| stm32mp157-ya157c-pinctrl.dtsi | MYD-YA57C-V2 开发板 pin 脚定义 |
在内核源码下 arch/arm/boot/dts 下可以看到大量的平台设备树。
修改stm32mp15xx-ya157c.dtsi
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| // SPDX-License-Identifier: (GPL-2.0+ OR BSD-3-Clause)
/*
* Copyright (C) STMicroelectronics 2019 - All Rights Reserved
* Author: Alexandre Torgue <alexandre.torgue@st.com> for STMicroelectronics.
*/
#include "stm32mp157-m4-srm.dtsi"
#include "stm32mp157-m4-srm-pinctrl.dtsi"
#include <dt-bindings/mfd/st,stpmic1.h>
#include <dt-bindings/input/input.h>
/ {
memory@c0000000 {
device_type = "memory";
reg = <0xc0000000 0x20000000>;
};
reserved-memory {
#address-cells = <1>;
#size-cells = <1>;
ranges;
mcuram2: mcuram2@10000000 {
compatible = "shared-dma-pool";
reg = <0x10000000 0x40000>;
no-map;
};
vdev0vring0: vdev0vring0@10040000 {
compatible = "shared-dma-pool";
reg = <0x10040000 0x1000>;
no-map;
};
vdev0vring1: vdev0vring1@10041000 {
compatible = "shared-dma-pool";
reg = <0x10041000 0x1000>;
no-map;
};
vdev0buffer: vdev0buffer@10042000 {
compatible = "shared-dma-pool";
reg = <0x10042000 0x4000>;
no-map;
};
mcuram: mcuram@30000000 {
compatible = "shared-dma-pool";
reg = <0x30000000 0x40000>;
no-map;
};
retram: retram@38000000 {
compatible = "shared-dma-pool";
reg = <0x38000000 0x10000>;
no-map;
};
};
/* 屏蔽有些功能，释放GPIO脚
joystick {
compatible = "gpio-keys";
#size-cells = <0>;
button-0 {
label = "usr_button";
linux,code = <KEY_ENTER>;
interrupt-parent = <&gpioi>;
interrupts = <11 IRQ_TYPE_EDGE_RISING>;
};
};
led {
compatible = "gpio-leds";
blue {
label = "heartbeat";
gpios = <&gpioa 14 GPIO_ACTIVE_HIGH>;
linux,default-trigger = "heartbeat";
default-state = "off";
};
red {
label = "red";
gpios = <&gpioa 13 GPIO_ACTIVE_HIGH>;
linux,default-trigger = "none";
status = "okay";
};
};
*/
wifi_pwrseq: wifi-pwrseq {
compatible = "mmc-pwrseq-simple";
reset-gpios = <&gpiof 3 GPIO_ACTIVE_LOW>;
};
/*
panel_backlight: panel-backlight {
compatible = "gpio-backlight";
gpios = <&gpiob 8 GPIO_ACTIVE_HIGH>;
default-on;
status = "okay";
};
panel_backlight: panel-backlight {
compatible = "pwm-backlight";
pwms = <&pwm4 0 5000000>;
brightness-levels = <0 4 8 16 32 64 128 255>;
default-brightness-level = <6>;
status = "okay";
};
*/
usb_phy_tuning: usb-phy-tuning {
st,hs-dc-level = <2>;
st,fs-rftime-tuning;
st,hs-rftime-reduction;
st,hs-current-trim = <15>;
st,hs-impedance-trim = <1>;
st,squelch-level = <3>;
st,hs-rx-offset = <2>;
st,no-lsfs-sc;
};
vin: vin {
compatible = "regulator-fixed";
regulator-name = "vin";
regulator-min-microvolt = <5000000>;
regulator-max-microvolt = <5000000>;
regulator-always-on;
};
vdd_usb: fixedregulator@3 {
compatible = "regulator-fixed";
regulator-name = "vdd_usb";
regulator-min-microvolt = <3300000>;
regulator-max-microvolt = <3300000>;
startup-delay-us = <70000>;
regulator-boot-on;
regulator-pull-down;
};
vddref: fixedregulator@2 {
compatible = "regulator-fixed";
regulator-name = "vddref";
regulator-min-microvolt = <3300000>;
regulator-max-microvolt = <3300000>;
startup-delay-us = <70000>;
enable-active-high;
};
};
......
|
修改后编译设备树
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| PC$ make ARCH=arm dtbs LOADADDR=0xC2000040 O="$PWD/.. /build"
PC$ cp $PWD/../build/arch/arm/boot/dts/st*.dtb $PWD/../build/install_artifact/boot/
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网络更新内核
在生成输出文件下 build/install_artifact/ 使用 scp 方式传输需要更新的文件。
挂载 boot 目录
若 stm32mp157c使用 ubuntu 文件系统下，需要先挂载 boot 目录。
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| root@stm32mp1: fdisk -lu
......
Device Start End Sectors Size Type
/dev/mmcblk2p1 34 4129 4096 2M Microsoft basic data
/dev/mmcblk2p2 4130 135201 131072 64M Linux filesystem
/dev/mmcblk2p3 135202 167969 32768 16M Linux filesystem
/dev/mmcblk2p4 167970 6926369 6758400 3.2G Linux filesystem
/dev/mmcblk2p5 6926370 7335969 409600 200M Linux filesystem
root@stm32mp1:~# mount /dev/mmcblk2p2 /boot
root@stm32mp1:~# cd /boot
root@stm32mp1:/boot# ls
boot.scr.uimg splash.bmp uImage
lost+found stm32mp157c-ya157c-hdmi-v2.dtb uInitrd
mmc0_extlinux stm32mp157c-ya157c-lcd-v2.dtb
mmc1_extlinux stm32mp157c-ya157c-v2.dtb
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更新 uImage 与设备树
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| PC$ scp -r boot/* root@192.168.31.80:/boot/
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更新内核 modules
删除编译生成文件 build/install_artifact/lib 下的软连接文件
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| PC$ rm lib/modules/<kernel version>/source lib/modules/<kernel version>/build
PC$ scp -r lib/modules/* root@192.168.31.80:/lib/modules/
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结束语
STM32MP157C更新内核，也可以直接拷贝至bootfs.ext4分区文件中，方便制作TF卡引导或者TF卡批量刷机。
